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Senior Thermal Engineer, DCGAP Thermal Mechanical Engineering

THE ROLE:

As a Senior Thermal Engineer in the Data Center and GPU Accelerated Processing (DCGAP) Thermal Mechanical Engineering department, you will be responsible for the thermal design, validation and technology development for the AMD Data Center GPU products in this expanding and strategic market for AMD.  To accomplish this, you will need to interact with other key engineering teams such as silicon design, boarding engineering, validation, and manufacturing and leaders within AMD, our customers, and our partners.

THE PERSON:

The Senior Thermal Engineer in the Thermal Mechanical Engineering team will have excellent communication skills, planning skills, technical expertise, is a team player, possesses critical problem solving and troubleshooting skills, is a self-starter, and is well organized. They will be market savvy and comfortable in a fast paced, multi-tasking environment.

KEY RESPONSIBILITIES:

The Senior Thermal Engineer in the Thermal Mechanical Engineering team will be responsible for the end-to-end development and delivery of thermal and/or mechanical solutions for the GPU and associated platforms. The successful candidate will have a thermal and mechanical development background with silicon level or system level experience. They will integrate into a global development team in delivering commercially viable products (silicon to systems) to the marketplace in a timely and cost-effective manner.

Some of the key responsibilities will include

•              Design thermal solutions to enable AMD's next generation of Datacenter GPUs

•              Collaborate with board engineering, power engineering and other cross-functional teams to design thermal-mechanical solutions from chip to system level

•              Contribute to the overall product cycle from conceptualization through mass production

•              Work in a dynamic and fast-paced product development environment

•              Thermal validation of thermal-mechanical hardware at chip, card and system level

•              Investigate novel thermal technologies and work with vendors to productize it

•              Drive process improvements while executing fast time-to-market on products.

PREFERRED EXPERIENCE:

The selected candidate will use his/her proven technical skills to ensure the engineering team continuously innovates, uses ‘best practices’, and adds value for its customers. Key qualifications required include

•              Strong background in heat transfer and fluid dynamics with emphasis on electronics thermal management

•              CFD/ FEA - Experience with Icepak and/or Flotherm is required. FEA experience in ANSYS is a plus.

•              CAD - Experience with SolidWorks and/or Creo is required.

•              Datacenter and server level design experience

•              Lab Skills - Experience with Design of Experiments, instrumentation, data acquisition and data analysis, including uncertainty analysis.

•              Excellent verbal and written communication skills at the engineering and executive levels, including a proven track record of working across organization boundaries to define requirements, solve complex problems and drive programs to successful completion

•              Manufacturing - Good knowledge of Design for Manufacturing, including experience with volume manufacturing in Asia as well as North America

•              Experience with engineering statistical analysis methods

ACADEMIC CREDENTIALS:

BS 8+ yrs in Mechanical Engineering or applied physics is preferred.  Any speculation in related field is advantageous.   An advanced Engineering degree would be an added plus.